DIPSOL TS-3300 is jet stream type, Pb-free, Sn-Ag alloy plating bath.
This process will deposit stable and bright alloy plating at the Ag co-deposition
ratio of 3.5wt%, and it is effective substitute for conventional Tin-Lead Alloy
(Solder) plating.

ApplicationsJet Stream Type Plating
Features●Ag 3.5% co-deposition ratio could be obtained stably and
best for the replacement of Sn-Pb plating.
●Desired uniform Ag deposition ratio and appearance deposit
could be obtained in wide current density range.
●Excellent leveling, ideal for soldering.
●Prevents whisker formation.
●Free of cyanide, fluoride/stable bath.
●Waste water treatment done by simple neutralization process.
ParametersTemperature 23~27°C
Current Density 30~80A/dm2

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