DIPSOL TS-3200 is Pb-free, Sn-Ag alloy plating process that is suitable for plating
system of continuous carrying type and hoop type.
This process will deposit stable and semi-bright alloy plating at the Ag co-deposition
ratio of 3.5wt%, and it is effective substitute for conventional Tin-Lead Alloy (Solder) plating.

Features- Ag 3.5% co-deposition ratio could be obtained stably and
best for the replacement of Sn-Pb plating.
- Desired uniform Ag deposition ratio and appearance deposit
could be obtained in wide current density range.
- Excellent leveling, ideal for soldering.
- Prevents whisker formation.
- Free of cyanide, fluoride/stable bath.
- Waste water treatment done by simple neutralization process.
ParametersTemperature 22~28°C
Current Density 10~30A/dm2

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