TS-3000
DIPSOL TS-3000 is Pb-free, Sn-Ag alloy plating process which is capable of operating at high current density.This process will deposit stable and bright eutectic alloy plating at the rate of Silver 3.5%, and it is effective substitute for conventional Tin-Lead Alloy (Solder) plating.
劇物（毒物及び劇物取締法）
労働安全衛生法
りん含有製品
チッ素含有製品
危険物（消防法）
| Applications | Rack Plating Hoop Plating |
|---|---|
| Features | ●Ag 3.5% co-deposition ratio could be obtained stably and best for the replacement of Sn-Pb plating. ●Desired uniform Ag deposition ratio and appearance deposit could be obtained in wide current density range. ●Excellent leveling, ideal for soldering. ●Prevents whisker formation. ●Free of cyanide, fluoride/stable bath. ●Waste water treatment done by simple neutralization process. |
| Parameters | Temperature 22～28°C Current Density 10～50A/dm2 |
| 商品名 | 法規情報 | 荷姿 |
|---|
関連法規に関する記号
劇物（毒物及び劇物取締法）
労働安全衛生法
りん含有製品
チッ素含有製品
危険物（消防法）
